50 lines
2.1 KiB
Plaintext
50 lines
2.1 KiB
Plaintext
=============================================================================
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AST RESEARCH, INC. TECHNICAL BULLETIN #0690 06-18-91
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=============================================================================
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EXCESSIVE HEAT IN TOWER EISA SYSTEMS
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Tower EISA systems with 80486 processor boards installed exhibit intermittent
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failures under certain operating environments. Normally under these
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conditions there are one or more Host Bus Adapters (HBA's) or multiple
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network interface cards installed in the system as well as the processor
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card. The failures exhibited are:
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- Complete system halts, forcing a reset of the system,
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- Error messages generated by the operating system in use.
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The cause of these intermittent failures has been proven to be caused by
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excessive heat buildup in the tower enclosure due to improper placement or
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installation of the enclosure itself. To insure proper operation of Tower
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EISA systems in all operating environments, the following guidelines must be
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met:
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1. Proper ventilation must be supplied for the Tower enclosure
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2. Ambient air temperature must be within the specifications stated in
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the Tower User's Manual.
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3. All system covers, including drive bay covers, must be installed
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while the system is operating. These enclosures are designed for
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optimal air flow with the covers in place.
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4. The processor board installed in the system must be a particular
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revision level. The processor boards listed below have a vented
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bracket (AST part number 200412-001) installed which aids air flow.
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Processor Board Part Number Revision
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486-25 202361-002 N
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486-33 202361-004 D
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486-25 202361-005 D
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486-25 202361-006 B
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486-33 202361-007 B
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486-25 202397-001 X3
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486-33 202397-002 B
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